Characteristics And Application Of Silicon Nitride Ceramic Substrate

1. Technical characteristics: 

High strength and high thermal conductivity silicon nitride ceramic substrate, its bending strength is 2-3 times that of aluminum nitride ceramic substrate, which can improve the strength and impact resistance of silicon nitride ceramic copper-clad plates, and thicker oxygen-free welding Copper does not cause porcelain cracking, which improves the reliability of the substrate. By covering the thick copper substrate, its thermal conductivity is 3-4 times that of the alumina ceramic substrate, which greatly improves the heat dissipation performance of the substrate, stronger current carrying capacity of the substrate, better overall heat dissipation performance of the substrate, lower thermal resistance, and better resistance to temperature impact.

2. Scope of application: 

Silicon nitride ceramic substrate has the characteristics of high strength, high thermal conductivity and high reliability. It can be used to make circuits on the surface by wet etching process, and it is a high reliability electronic substrate produced after surface plating. It is an important substrate material for the new 1681 power control module for electric vehicles. In addition, the ceramic substrate industry also involves LED, fine ceramic preparation, thin film metallization, yellow light lithography, laser molding, electrochemical plating, optical simulation, microelectronics welding and other fields. The products have a wide range of applications in power transmitters, photovoltaic devices, and IGBT modules. , Power thyristors, resonator bases, semiconductor packaging carrier boards and other high-power optoelectronic and semiconductor devices.